Splitted-Desktop Systems jointly with Tyan announced general availability of S2350 mini ITX motherboard

France/15 January 2009/PRMinds / Splitted-Desktop Systems a French based computing and consumer electronics company announced today the general availability of the S2350 motherboard developed jointly with Tyan. This board is dedicated to low power high efficiency computing usage and supports AMD S1 mobile processors bringing advanced internet experience and ready for small footprint server functions.

Splitted-Desktop Systems (SDS), a French based company, is developing products dedicated to Internet usage, including Internet Terminals, IPTV set-top boxes, connected TV and mobile devices. SDS is delivering technologies, products and solutions to ISP’s, hospitality businesses, and digital signage companies, as well as service oriented companies where performance and low noise solution is required. SDS products are exclusively based on industry standard technologies (x86 microprocessors, 3D chipsets supporting OpenGL).

Jointly developed with Tyan, a leading Taiwanese server and motherboard supplier, the S2350 motherboard has one of the best performance per watt in the market ever achieved using Embedded AMD Mobile Sempron and Mobile Turion 64 microprocessors and bring new user experience capabilities by dramatically reducing PC power consumption.

S2350 motherboard requires a maximum power of 65 Watts fully populated and an average of 30 watts with standard based configuration, allowing fanless operation without performance tradeoffs required by competitive solutions.

Integrated within various solutions from Splitted-Desktop Systems the board is under mass production and has been retained by Orange Valley within the « Pack Internet Facile » terminal, a consumer oriented terminal dedicated for elder people.

S2350 can be used for various applications, including constraint environment (automatic system, gambling machines, Internet access point, multimedia machines, low power request servers).

Designed to run fanless, S2350 is exclusively using solid state capacitors for critical functions support, and deeper PCB to reduce bending issues. It is using High speed mobile technology on a desktop form factor board to bring the best of both worlds into one product.

S2350 features and functions include:

• 1 S1 socket for AMD Mobile Sempron and Turion 64 X2 support
• ATI RS690E and SB600
• 1 Compact Flash port
• 1 LVDS port to drive TFT panel
• 1 TPM
• 1 mini PCI slot
• 2 internal com ports
• 2 internal firewire ports
• 32 MB Local Frame Buffer to lower power consomption of GPU
• 6 USB 2.0 external port available on I/O backing plate
• 4 USB 2.0 internal port
• 2 Gigabits Ethernet port from Realtek
• Up to 4 GB of main Memory ( 2x So-Dimm DDR II @667Mhz)
• 1 DVI-D port, 1 7.1 analog audio out, 1 SP/DIF Optical port
• Support Linux natively (primary O/S used by SDS) and Windows Vista with Aero mode

Product package includes:
• 1 S2350 Motherboard
• 1 CPU and North Bridge heat sink with embedded heat pipe
• 1 backing plate I/O shielding
• 1 S1 AMD Mobile processor (AMD Mobile Sempron 2100+ 8Watts, or AMD Mobile Sempron 3600+ 25 Watts, or AMD Mobile Sempron 3700+ 25 Watts, or AMD Mobile Turion 62X2 TL62 31 Watts)